Detection of thermal silica effect of the use

Thermal conductivity potting has excellent electrical insulation properties, able to withstand environmental pollution, avoid stress and environmental factors such as vibration and moisture damage of electronic products, especially for potting material requirements for heat dissipation good product. The product has excellent physical and chemical properties. After a 1:1 mixture of fast-curing or heat curing at room temperature, minimal shrinkage, thermal curing process and hold no solvents or cure byproducts have repairable, can be deep solidified into elastomers.
       Thermal silica film having a certain flexibility, excellent insulation resistance, compression resistance, a natural surface tack, specifically for the use of heat transfer design slit production to fill the gap, complete heating and cooling heat transfer between the parts, but also played insulation, shock absorption, seals and other effects, to meet the miniaturization and ultra-thin design requirements, is of great craft and usability, and the thickness of the wide range of applications, is an excellent thermal conductivity filler material being Widely used in electrical and electronic products.

       In practical applications, since it will increase the power causes rapid thermal impedance dropped 10K / W or less, the temperature of foreign industry have developed white LED try to alleviate the above problem by this method, but in fact the calorific power LED smaller than a few times over the high power LED, and the temperature rise of the light emitting efficiency will drop dramatically, even when the package technology allows high-calorie, but there is the LED chip junction temperature may exceed the allowable value, in this case, the solution encapsulation method is the fundamental problem of heat dissipation.

       HC thermal silica films in the major consumer electronics products have a relatively wide range of applications: such as communications equipment, computers, open light power, flat panel TVs, mobile devices, video equipment, network products, home appliances, PC service station / workstations, CD-ROM , laptops, put the base station and so on.

        Thermal silica film is based on silica as a substrate, the addition of metal oxides and other DPM, through a special process synthesis of a thermally conductive dielectric material in the industry, also known as thermal silicone pad, thermal silica films, soft thermal pad etc., is dedicated to the use of heat transfer design slit production to fill the gap, complete heating and cooling heat transfer between the parts, but also as an insulating, cushioning, sealing and so on, to meet the miniaturization of the equipment and ultra thinning of the design requirements, is of great craft and usability, and the thickness for a wide range, is an excellent thermal conductivity filler material.